Advanced Cleanroom Systems for Semiconductor & Microelectronics

ISO 14644 & SEMI-compliant enclosures engineered for precision.

High-Performance Systems Built for Next-Gen Microelectronics

Avanteclad’s cleanroom panels, partitions, and ceiling systems for semiconductor and microelectronics facilities are built to handle ultra-stringent cleanroom classifications (Class 1 – Class 100K). These systems offer:

ESD-Controlled Panels: Conductive and non-conductive finishes for critical tool areas.
Low-Outgassing Core Materials: Aluminum honeycomb, Rockwool, PUF, PIR designed to minimize particle emission.
Tool & Utility Integration: Factory-prepared cutouts, return-air risers, and service ducts for seamless HVAC and equipment installation.
Fire-Safe Configurations: Panels suitable for high-risk operational zones.
Durability in Harsh Environments: Resistant to chemical vapors, solvents, and high-temperature.

Engineering Highlights and System Features

Wall Thickness Options: 50 mm, 80 mm, 100 mm to match cleanroom design load and acoustic requirements.
Height & Width Range: Standard width up to 1200 mm, heights up to 7000 mm for large tool bays without any joint.
Core Materials: Aluminum Honeycomb (21 mm core, 0.05 mm foil), Rockwool, PUF, or PIR for fire resistance and thermal stability.
Surface Finishes: PVDF, PE, Life Antimicrobial, or SS-304/316, tailored to conductivity and hygiene needs.
Installation Flexibility: Progressive and non-progressive panel systems for both permanent and reconfigurable layouts.
Integrated ESD Solutions: Conductive SS surfaces and anti-static coatings for wafer-handling zones.
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Business Impact of Avanteclad Semiconductor Systems

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Accelerated Project Execution

Pre-engineered modular panels cut installation timelines by 20–25%.

Yield Enhancement

Low-particulate, non-shedding panels help minimize defects in wafer and die production.

Scalable Infrastructure

Non-progressive partitions allow quick reconfiguration for tool replacement and process upgrades.

Compliance Assurance

Built to meet ISO 14644, SEMI S2/S8, and customer-specific cleanroom protocols.

Operational Uptime

Robust construction minimizes maintenance cycles and contamination risks.

Technical Variants for Semiconductor & Microelectronics Cleanrooms

Stud Wall Panel System

Panel Type

50 mm thick Aluminum Honeycomb Core.

Facings

0.5 mm PE Roll-Coated Steel, non-conductive surface with protective film.

Core Spec

21 mm aluminum honeycomb, 0.05 mm foil thickness.

Adhesive

Polyurethane base.

Fire Rating

Non-combustible.

Stud-less Wall Panel System

Panel Type

Aluminum Honeycomb Core (50 mm).

Facings

0.5 mm PE Roll-Coated Steel.

Low-Outgassing

construction suitable for critical lithography and etch tool zones.

Fire Rating

Non-combustible.

Cladding Wall Panels

Designed

For direct cladding on civil walls.

Core

7 mm or 12 mm Aluminum Honeycomb.

Facings

0.5 mm PE Roll-Coated Steel.

Combustion Property

Non-combustible and ESD compliant.

Ceiling Grid Systems for Semiconductor Environments

Walkable Ceiling Grid System

Load-bearing structure for FFUs, cable trays, and tool service racks.
Ceiling T and D: 70 mm height, 55 mm width, anodized aluminum alloy.
Panel Type: 30 mm Aluminum Honeycomb Ceiling Panel.
Panel Dimensions: 600×1200 mm or 1200×1200 mm.

Non-Walkable Ceiling Grid System

Light-duty grid for areas with low utility loads.
Cold roll metal sheet (1.0 mm or 1.2 mm), powder-coated finish.
Panel Dimensions: 600×1200 mm or 1200×1200 mm.

Plenum Ceiling System

Supports secondary ceiling structures and integrated FFU module connections.
Panel Type: 50 mm Rockwool panel with 100 kg/m³ density.
Adhesive: Polyurethane-based for long-term stability.

Targeted Industry Applications

Semiconductor Fabs

Wafer fabrication and lithography areas (Class 1 – Class 100).

Microelectronics Assembly

PCB and chip packaging environments requiring ESD control.

R&D Labs

Prototype and pilot lines needing reconfigurable infrastructure.

Solar PV Cell Lines

High-temperature and chemical-resistant panels for continuous operations.

Projects Delivered

Client: [Placeholder Semiconductor Manufacturer]
Scope: 25,000 sq. ft. Class 10 cleanroom infrastructure with integrated FFU-support ceiling grids.
Execution Time: 8 weeks – from design validation to site installation.
Outcome: Reduced installation cycle time by 35% while achieving ISO 14644-1 Class 10 certification.

Why Avanteclad’s Semiconductor Systems Lead the Market

25+ Years of Cleanroom Expertise

Backed by ACES, a leader in turnkey cleanroom solutions.

High-Volume Production

200,000 sq. m. annual modular partition output.

Automated, Global-Grade Manufacturing

Advanced renowned brands semi-automated manufacturing line.

Design + Build Excellence

Seamless coordination from panel engineering to on-site commissioning.

Customization at Every Level

Every semiconductor or microelectronics cleanroom has unique contamination control, ESD, and equipment-loading requirements. Avanteclad offers end-to-end customization:

Panel Thickness, Core, and Finish: Tailored for fire safety, chemical resistance.
Utility Integration: Pre-engineered cutouts, risers, and conduit paths for high-density tool bays.
Scalable Modules: Fully demountable designs for facility expansion or process changeovers.